SMT & DIP
Surface-mount assembly and through-hole soldering.
OUR CAPABILITIES
From a clear brief
to a complete assembly.
Bring engineering, sourcing, manufacturing and assembly into one project conversation.
01 / ENGINEERING
Start with the right questions.
We help translate your requirements into an electronics and production plan, with attention to manufacturability and integration.
- Product requirements and feasibility discussion
- Design-for-manufacturing review
- Component sourcing and alternatives review
- Prototype development and technical support
- Failure analysis and rework discussion
REQUIREMENTS → DESIGN → PROTOTYPE02 / MANUFACTURING
Keep the process connected.
Production capabilities include SMT, DIP, inspection and functional testing, with the project requirements agreed before manufacturing.
Programming
Firmware programming as specified for the project.
Inspection & testing
Incoming checks, AOI and functional testing.
Finishing
Conformal coating and finishing where required.
A COMPLETE ASSEMBLY
Electronics+Wire harness+Enclosure↓Your product
03 / PRODUCT ASSEMBLY
Think beyond the circuit board.
Our work extends to harnesses, product integration and final assembly. Define the scope with our team so the manufacturing plan matches the product you need to deliver.
- Wire-harness production
- Electronics and enclosure assembly
- Functional checks for the agreed configuration
- Packaging to project requirements
QUALITY THROUGH THE PROCESS
Agree the requirements.
Check the result.
Before production
Review the specification, material requirements and acceptance criteria with the project team.
During production
Use inspection and test steps suited to the assembly and the agreed manufacturing plan.
Before delivery
Confirm functional requirements and packaging, with documentation agreed for your project.